From the aspects of printing control, compounding control, and curing before compounding, the key points of the process control of solvent-free compounding nylon high-temperature cooking bag are fully explained .
1. Printing control before compounding
A. The amount of color ink and curing agent should be appropriate when printing high temperature resistant solvent-free composite products.
In general, ink manufacturers will give a reference ratio when providing ink. At the same time, a small test should be done before production in a flexible packaging factory. If the amount of curing agent is too small, the degree of crosslinking between the curing agent and the resin will be low. The adhesion strength of the ink layer, Heat resistance and hydrolysis resistance will be reduced; if too much curing agent, excessive cross-linking will occur, affecting the crystallization and micro-phase separation between the polymers, the cohesive force of the adhesive layer increases, the ink layer shrinks excessively, causing delamination , It will also cause more operational problems, such as the bag after compounding will become hard.
B. The printed film should be fully cured before compounding.
High-temperature cooking solvent-free glue layer may react with the ink layer, resulting in insufficient cross-linking and curing of the ink, and the film will be delaminated during subsequent cooking. Therefore, the printed film must be fully cured before compounding.
C. Avoid mixing different series of inks.
D. Control the use of old ink.
2. Compound control
A. High-temperature cooking solvent-free glue should choose a model with good medium resistance (heat resistance, freezing, acid, alkali, salt, oil, spicy, etc.) and non-toxic, no odor, good hygiene and safety.
In fact, high-temperature cooking and packaging has always been a difficult problem in the field of solvent-free compounding, and it has also become a barrier in the promotion of solvent-free compounding processes. In fact, in order to successfully implement a solvent-free compound process for high-temperature cooking and packaging, the most important thing is to develop a solvent-free compound glue that can be used for high-temperature cooking and packaging. Solvent-free glue that can withstand high temperature cooking and packaging has become the focus of many glue companies.
B, and high temperature cooking without a solvent glue composite reasonable than to group assignment. Although the glue manufacturer will give a glue ratio, it is often an approximate or theoretical ratio. To achieve a good compound effect, we must conduct experimental verification to find a ratio that matches other materials and environments, that is, It is necessary to ensure that the crosslinking of the curing agent and the resin is sufficient, and excessive crosslinking does not occur, thereby avoiding delamination and high temperature cooking delamination.
C. The high-temperature cooking solvent-free composite phase is more common than ordinary products. One is to ensure that the glue is uniform, to avoid local excessive cross-linking curing and low local cross-linking. The temperature of the glue device and the glue roller keeps the glue at a suitable viscosity and ensures the amount of glue in the compounding process.
3. Aging
Compared with the low-temperature and normal-temperature curing of ordinary solvent-free compound, the high-temperature cooking solvent-free compound should pay special attention to the process design and management of the curing process, and the temperature and time design should be reasonable to ensure that the curing is sufficient.
Some of our test operator, the test in front of a section for a solvent-free glue, the curing temperature is recommended to be at least 55 ℃, curing time extended over 96h, the barn door is not often closed to open, as far as possible into the composite film Do not open the door afterwards, until the specified time, one-time aging is fully taken out.
According to operating experience, if a product cannot be fully cured at one time, the peeling force of the second curing is much worse than that of the first curing, and it is also easy to delaminate and cause high temperature cooking delamination.
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