Low temperature application of hot melt adhesive formulation

Patent Name Packaging Patent for Low-Temperature Hot Melt Adhesive Preparation Applicant National Starch and Chemical Investment Holding Company Principal Applicant Address Delaware Inventor CW Paul; AP Rogers Application (Patent) No. 01821676.5 Date of Application 2001.10.31 Award date Approval Notice No. 1531499 Date of approval announcement 2004.09.22 Instruction CD No. D0438 Main classification number B65B63/08 Classification No. B65B63/08; B29B13/02; C09J11/00 Division Original Application No. Priority Abstract Use melting point Low temperature hot melt adhesives for film packaging below about 100°C. There is no need to remove the packaging film before using the adhesive. The packaged adhesive is easy to handle and the units do not clump. Sovereign Items 1. A packaged low temperature hot melt adhesive comprising a low temperature hot melt adhesive packaged in a thermoplastic film having a melting point of less than about 100°C.